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Sputtering Targets (Metal, Refractory & Ceramic)

Coating Materials, Powders & High-Purity Metals

Sputtering Targets (Metal, Refractory & Ceramic)

Melt-forged metal targets, powder-metallurgy refractory targets and bonded ceramic targets for thin-film deposition.

  • Melted & forgedAl, Cu, Ti, Ni and alloys — 4N to 6N; uniform equiaxed grains
  • Powder metallurgyW, Mo, Ta, Nb, Cr — 2N5 to 4N; average grain < 100 μm
  • CeramicOxide and compound targets, indium-bonded to OFHC copper backing plates

Technical datasheet available on request.

Specifications

Specifications of Sputtering Targets (Metal, Refractory & Ceramic)
Melted & forgedAl, Cu, Ti, Ni and alloys — 4N to 6N; uniform equiaxed grains
Powder metallurgyW, Mo, Ta, Nb, Cr — 2N5 to 4N; average grain < 100 μm
CeramicOxide and compound targets, indium-bonded to OFHC copper backing plates
ShapesPlanar round / rectangular, rotary — to drawing
Other elementsZr, Hf, Co, precious-metal targets ≥ 99.95%

Values are reference information compiled from supplier documentation. Final grade, standard, condition and test values are confirmed in the quotation and order documents.

Key selection parameters

  • Composition and purity
  • Dimensions and tolerance
  • Density and grain size
  • Backing plate and bonding
  • Deposition equipment interface

Typical applications

  • Semiconductor and display films
  • Optical and decorative coating
  • Hard and functional coatings

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