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Coating Materials, Powders & High-Purity Metals

Metal Thermal Interface Materials & Indium

Gallium-based liquid metal and metal pastes, low-melting BiSnIn phase-change pads, and high-purity indium foil and wire.

  • Metal thermal pasteGaInSn(Zn)(Ag) system, > 15 – 20 W/m·K
  • Liquid metal> 30 – 70 W/m·K
  • Phase-change padsBiSnIn, 59 °C melting, > 30 – 50 W/m·K

Technical datasheet available on request.

Specifications

Specifications of Metal Thermal Interface Materials & Indium
Metal thermal pasteGaInSn(Zn)(Ag) system, > 15 – 20 W/m·K
Liquid metal> 30 – 70 W/m·K
Phase-change padsBiSnIn, 59 °C melting, > 30 – 50 W/m·K
Indium foil0.05 – 1 mm, 99.99 – 99.999%
Indium wireΦ0.5 – 8 mm
ComplianceRoHS (supplier data)

Values are reference information compiled from supplier documentation. Final grade, standard, condition and test values are confirmed in the quotation and order documents.

Key selection parameters

  • Operating / phase-change temperature
  • Thermal resistance target
  • Contact pressure and surface
  • Substrate compatibility
  • Thickness and shape

Typical applications

  • CPU / GPU and power-module cooling
  • Laser and optical devices
  • Vacuum sealing and cryogenic joints

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